Brillo Comes to Intel® IoT Technology

Get access to the new Intel® IoT Developer Kit, a complete hardware and software solution that allows developers to create exciting new solutions with the Intel® Galileo and Intel® Edison boards. Visit the Intel® Developer Zone for IoT.

Brillo*, released today via an invitation program from Google*, offers a holistic approach to the IoT solution landscape. Combine it with Intel® IoT technology, and the possibilities are vast. The Intel® Edison module is a great starting point for developers designing for IoT. With a robust feature set including a high-performance, low-power dual-core CPU and integrated Wi-Fi* and Bluetooth*, IoT developers can quickly innovate their ideas through the development lifecycle.

Brillo* and Weave* form a solution for building connected devices. Incorporating aspects of the Android* platform, Brillo* brings security, local and inter-device service compatibility, and a modular approach to building system components. Sitting on top of Brillo*, Weave* is an open communications protocol that supports discovery, provisioning, and authentication so that devices can connect and interact with one another, the Internet, and your mobile platforms.

Verified functionality of Brillo* with the Intel® Edison module now results in a versatile and secure IoT platform for scaling your projects beyond proofs of concept. The built-in and pre-certified connectivity of the Intel® Edison module, as well as the small form factor, open the door for new products and services that seamlessly connect with other devices.

A Brillo*-compliant solution built upon the Intel® Edison module is coming soon from Newegg*. Visit our page to find out more about Brillo* and the Intel® Edison board.